Mask aligner

Suss Microtec

MA/BA6 Gen4

Litography

Mask aligner designed to accurately align masks with substrates enabling photolithography

Top side alignment mode.

Substrate thickness up to 6 mm.

 

Exposure modes:

• proximity
• soft contact
• hard contact
• vacuum contact
• 350 W exposure lamp, Hg

 

Alignment mode:

• top side

 

Chucks:

• 1″ square chuck for pieces at least 10×10 mm up to substrates 1″ x 1″
• 2×2″ square
• 4″ (100 mm) wafer

 

Mask holders:

• 2 inch
• 3 inch, possible to use proximity flags
• 5 inch, possibility to use proximity flags

 

Filters:

• i-line filter
• ND33 filter

 

Objective:

• 5x
• 7.5 offset